The 2017 SPAR 3D conference and expo, scheduled for April 3-5 in Houston, is right around the corner. The organizers of the event, Diversified Communications, is already working on SPAR 3D 2018 has announced that next year it will co-locate with AEC Science & Technology (AEC-ST). The co-location of SPAR 3D and AEC-ST will take place June 5-7, 2018 in Anaheim, Calif.

SPAR 3D conference content covers 3D sensing, 3D processing and 3D visualization tools for applications in multiple industry sectors including architecture, engineering and construction (AEC); surveying and mapping; civil infrastructure; transportation; industrial facilities/plant; process; power and utilities; law enforcement; forensics and more. AEC-ST is an international conference and exhibition focused on delivering critical education and products for AEC professionals seeking to keep pace with the fast-changing landscape of technology solutions and advanced workflows that are driving innovation and collaboration in the marketplace.

"The AEC segment is one of the fastest growing and largest potential verticals for 3D technology adoption," says Lisa Murray, group director at Diversified Communications." Top engineering and construction firms have always attended SPAR. Now they'll have more reasons to attend to access focused AEC conference content as well as expanded product offerings in a combined exhibit hall."

The 2018 event will feature thought leaders from around the globe in two distinct conference programs. Attendees will have the option to select an AEC or SPAR conference pass, or a combined passport to attend both. Exhibits will be integrated into one large exhibit hall at the Anaheim Convention Center, allowing attendees full access to all vendors. The organizers plan to offer multiple live-demonstration areas including a drone zone, AR/VR interactive environments, hands-on workshops, an AEC hackathon and a university lightening round competition.

About SPAR 3D Expo & Conference

As the global leader in 3D technology, SPAR 3D brings together hardware, software and visualization solutions providers from across the globe together under one roof for three days of education, exhibits and live demonstrations. Conference content covers 3D sensing, 3D processing and 3D visualization technologies.