Nikon's SITECH Group Introduces the NRM-3000 07.15.2002
Nikon's Semiconductor Inspection Technologies Group (SITECH) introduced their most advanced overlay measurement system to the U.S. market. The NRM-3000 combines Nikon's superior optics, advanced technology and immense experience in semiconductor photolithography to provide automatic measurement of overlay and NSR focus marks with the highest-speeds and exceptional precision.
The NRM system, which delivered stellar performance in the Japanese and Asian markets, features a high-precision, dedicated optical system with exceptional aberration management. The Nikon objective lens is designed specifically for overlay measurement and offers unsurpassed imaging performance with an exceptional high S/N ratio and high dynamic range characteristics.
The illumination system is bright and optically matched to the imaging system. It employs a fiber optic delivery system to an efficient and affordable quartz-halogen lamp. The user can easily replace the lamp without the need for any complicated or specialized procedures.
The NRM-3000 employs a high precision, actively damped stage and a new EGA alignment control technology, to assure correct and fast measurements. This has resulted in a class leading throughput performance of 150 wafers per hour (5 points/wafer).
Newly developed Nikon software offers superior recipe management functions that can be optimized quickly and easily. Waferless recipe creation offers automatic recognition of stepper alignment marks and other unique patterns. The creation of recipes without wafers on the stage is ideal for small lot, multiple productions.
Options for the NRM-3000 include a Stepper Management System (analysis for registration, distortion, stepping, reticle rotation and focus), the NSR Focus Mark Measurement System (high-speed, precision measurement of Nikon's exclusive NSR wedge-shaped focus marks), Recipe Management Functions (network control for the creation, portability and storage of recipes and data) and Arbitrary Angle Measurement (high speed and precision measuring of overlay marks at any angle).